ZAHIN BIN ZAILANI

• Performed requirement analysis through direct communication with customers to define equipment specifications.
• Designed semiconductor manufacturing equipment including basic and detailed mechanical design using CAD tools.
• Managed parts procurement, inventory control, and project scheduling to support equipment delivery timelines.
• Coordinated with external vendors and suppliers regarding specifications, delivery schedules, and quality control.
• Supported assembly and manufacturing processes by monitoring progress and resolving technical issues.
• Prepared English technical documents and supported overseas customer communication and inquiries.
• Contributed across the full project lifecycle in a small engineering team environment, from design to equipment delivery.

Key Achievements

• Implemented structured verification checklists to prevent specification errors and missing components.
• Recognized internally as a key engineer supporting English communication with overseas customers.

• Supported mechanical design development of semiconductor manufacturing equipment.
• Created and modified 3D CAD models and engineering drawings based on design requirements.
• Performed interference checks and drawing verification to improve design quality and manufacturability.
• Coordinated with internal departments and suppliers to manage specification changes and delivery schedules.
• Managed component ordering progress from procurement through delivery.
• Prepared operation manuals, work procedures, and technical documentation for internal and external use.
• Produced technical documents in both Japanese and English to support information sharing.

Key Achievements

• Improved documentation clarity by translating technical concepts into user-friendly instructions.
• Successfully handled multiple parallel tasks while maintaining project deadlines.