Yugendran Kaneson

Roles and Responsibilities:

• Delivered multiple process optimization tasks, improving UPH and reducing quality issues.
• Managed Process FMEA (PFMEA) for new wire bonding processes to systematically identify potential failure modes, assess risks and implement preventive actions.
• Utilized Statistical Process Control (SPC) tools such as control charts to monitor critical wire bond parameters, enabling early detection of process drift.
• Developed multiple automation scripts using the Python programming language for wire bonding quality control and reporting.
• Created Spotfire dashboards for device performance analysis and production trend monitoring.
• Participated in root cause analysis efforts to resolve complex issues related to customer complaint or feedback.
• Wire Bond Hold Lots Champion responsible for managing hold lots without impacting lot cycle time, and driving hold lots reduction projects.
• Wire Bond CWATY (Cost Weighted Assembly Test Yield) Champion to manage wire bond related scrap and drive towards scrap reduction.
• Represent TIM in various Worldwide Wire Bond Team roles such as Capillary Cost Control, Dynamic Sampling, Vision Automation and Quality Automation for wire bond capillary CPP reduction and small signals enhancement activities.

Major Projects and Achievements:

• Developed the 'Distance Reference Point' feature in collaboration with the machine vendor to detect incoming die placement issues.
• Created the 'S Loop Wire Bonding Technique' to eliminate post-mold wire sweep issues.
• Delivered a quarterly saving of USD15K by executing 'Wire Bond Capillary Lifespan Extension' project.
• Delivered a 50% improvement in UPH, MTBA, and machine capacity with $0 investment by executing 'Process Optimization at Die Attach and Wire Bond' to stabilize isolation device performance.
• Developed the 'Intelligent Wire Bond Layout Validation' project, which is a pioneer in the industry, to replace the manual validation process of mount and bond diagrams with an automated approach.
• Selected to attend the Texas Instruments Annual Technical Leadership Conference in Dallas, USA, and presented technical innovations to fellow technical members from all TI sites around the globe.

Leadership and Community Engagement:

• Leading the Wire Bond Quality Improvement Team (QIT), collaborating with cross-functional stakeholders (Manufacturing, Equipment, Process, Quality, and NPI) to drive strategic initiatives that enhance wire bond quality and performance.
• Served as President of TEXINS to foster inclusive culture and organize cross-departmental events among TI employees.

• Implemented automated strip map verification system for strip test process simplification.
• Developed technician reporting system to streamline job tracking of failure analysis.
• Contributed to a positive team environment by collaborating with fellow interns on group projects and presentations.
• Gained hands-on experience in various software programs, increasing proficiency and expanding technical skill set.
• Prepared project presentations and reports to assist senior staff.