Vic Chang

Power and Sensing platform lead in TI Taiwan.

• Lead cross-functional teams for successful product development, identify gaps, and ensure timely delivery tied to risk assessment.
• Managed crisis situations, implementing solutions to address unexpected challenges, to keep project momentum.
• Provide strategies and define executive plan for BOM/tool multi-source.
• Cultivate innovation with a clear problem statement, lead brainstorming, and empower the team to provide cutting-edge engineering solutions, setting new industry benchmarks.
• Enhance overall team productivity with continuous training and mentoring of junior engineers.

Driving the development and assembly lead for Reinforced Isolation power module, magnetic current sensing products in TI Taiwan.

• Managed 6 projects simultaneously, prioritizing tasks effectively to meet tight deadlines without compromising quality across different organizations and time zones.
• Hands-on person to conduct proof-of-concept all the time.
• Ensured compliance with industry regulations, maintaining up-to-date knowledge on packaging standards and guidelines.
• Optimized semiconductor package design through exploring new design, BOM, and equipment.
• Identified opportunities for cost-saving measures in existing processes while maintaining or improving packaging effectiveness and lowering COO.
• Served as a subject matter expert for packaging-related inquiries and provided training to junior team members on best practices in semiconductor package engineering techniques.

• Well experienced in wafer back grinding, dicing, and flip chip die attach process.
• NPI evaluation, development, and ramp monitoring.
• Sustain HVM line, UPH improvement, and drive cost reduction activities.
• FMEA and Control plan maintenance.
• Customer voice and 8D report handling.
• DoE and data analysis via JMP.