Nizar Zukri
Ph.D. Candidate
Hiroshima
Summary
Highly motivated Ph.D. Candidate with 8 years of semiconductor experience, including 5 years in industry and 3 years in advanced academic research. Proven ability to translate research into manufacturable, high-impact solutions. Seeking to contribute immediately within the semiconductor industry.
Expected Ph.D. graduation: March 2027, Hiroshima City University
Overview
6
6
years of professional experience
4
4
Certificates
Work History
Process and Equipment Development Engineer
Western Digital (Sandisk)
01.2020 - 09.2023
- Led process line setup, sustainment, and continuous improvement for SSD production, focusing on yield, UPH, SPC/APC implementation, automation, and cost reduction.
- Applied Six Sigma methodologies (DMAIC, 8D) and led RCCA to resolve chronic quality and equipment issues.
- Managed equipment buy-off and technology transfer, including wire bond to flip-chip transition for NAND SiP production.
Key Achievements:
- Optimized LTIM curing process, developing a universal curing profile and real-time monitoring, increasing throughput from 250 to 528 UPH.
- Improved FPY yield through Pareto analysis, false-call elimination, sub-process introduction, and system controls (CAMSTAR/FLEXFLOW).
- Led a major process elimination and cost reduction project, validated via HAST, e-ORT, and in-service testing, achieving USD 0.24M soft savings, USD 0.176M hard savings, and reducing 26 headcount and 118.7 sqm layout.
- Led flip-chip process and equipment qualification, defining CTQ/CTP, UPH, yield targets, and RFQs.
- Implemented material traceability and pot-life management using machine ID and automated warning systems, eliminating material purging.
- Improved equipment reliability through RCCA-driven redesign of sealant mechanisms (piston/O-ring), eliminating leakage failures.
- Redesigned equipment interfaces to reduce manual touchpoints and improve efficiency, managing RFQ, PR, and supplier design selection.
- Designed and implemented pneumatic purge solutions to enhance dispensing cleanliness and process stability.
- Deployed IoT-based SPC/APC infrastructure, including GR&R, sampling plans, OCAP, and transition to SECS/GEM auto-OCAP.
NPI Engineer
Flextronics
01.2018 - 12.2019
- Led end-to-end execution of 3 New Product Introduction (NPI) programs for router and switch manufacturing, serving as NPI Product Owner.
- Drove DFX activities (DFM/DFA) in collaboration with design, supplier, and manufacturing teams to ensure manufacturability and yield readiness.
- Coordinated and supported all manufacturing stages (SMT, Mechanical Assembly, Functional Test), resolving daily production issues, mitigating technical risks, and maintaining aggressive NPI schedules.
- Owned program quality metrics including FPY, RTY, and process capability (Cpk) across the production line.
- Led RCCA and continuous improvement initiatives, addressing issues across process, supplier, and customer design interfaces.
- Authored and controlled all critical NPI documentation: SIC, Work Instructions (WI), Control Plans (CP), Variance Requests (VAR), and Preventive Maintenance (PM).
Education
Ph.D. - MEMS (Micro-Electro-Mechanical Systems) Research
Hiroshima City University
Hiroshima03-2027
Master of Science - Control System & Instrumentation
University of Science Malaysia (USM)
Malaysia 04.2001 -
Bachelor of Science - Mechanical Engineering
University of Science Malaysia
Malaysia 04.2001 -
Skills
Semiconductor Process Engineering
Certification
Juniper Networks CEM Quality Award — Customer Recognition for Manufacturing & Quality Excellence
Timeline
Prestigious Government Scholarships: Japan Government (MEXT) and Malaysian Government (JPA)
04-2024
Intellectual Property: Contributor to 4 Company Trade Secrets Company Trade Secrets & 1 Patent Filing
09-2023
Lean Six Sigma Green Belt (LSSGB) Certification
05-2021
Process and Equipment Development Engineer
Western Digital (Sandisk)
01.2020 - 09.2023
Juniper Networks CEM Quality Award — Customer Recognition for Manufacturing & Quality Excellence
12-2018
NPI Engineer
Flextronics
01.2018 - 12.2019
Master of Science - Control System & Instrumentation
University of Science Malaysia (USM)
04.2001 -
Bachelor of Science - Mechanical Engineering
University of Science Malaysia
04.2001 -
Ph.D. - MEMS (Micro-Electro-Mechanical Systems) Research
Hiroshima City University
Leaderships
- Technical Mentor: Mentored 3 engineers, led 3 NPI programs, and delivered 9 high-impact process improvement projects
- Team Leadership: Supervised 15 process and equipment technicians in manufacturing and NPI environments
- Organizational Leadership:
President, Malaysian Student Society (University Level)
Head Prefect, Secondary School
Publications
Journal Articles (4)
International Conference Proceedings (8)
1. An Electroanalytical Instrument with Wireless Communication and GUI for Real-Time Wastewater Monitoring in the Batik Industry, Journal of Mechanical Engineering (SCOPUS), 2017.
2. Laser Micromachining of 3D Free-Standing Structures for MEMS Thermal Flow Sensors, IEEE Sensors Journal, 2025.
3. Laser Fabrication of Titanium Stent with Integrated MEMS Flow Sensor for Implantable Respiration Monitoring, Sensors and Actuators A: Physical, 2025.
4. Single-Step Laser Patterning and Thinning of Biocompatible MEMS Flow Sensors, Sensors and Actuators A: Physical, 2025.
International Conference Proceedings (8)
1. Single-Step Laser Fabrication of 3D Free-Standing Origami MEMS Thermal Sensor, IEEE SENSORS, Kobe, Japan, 2024.
2. Laser Micromachined 3D-Shaped Free-Standing Structures on Flexible Substrate for Thermal Flow Sensor, 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Orlando, USA, 2025.
3. Motion Analysis of a Low-Cost Customized A-Scan Non-Destructive Testing Unit, MATEC Web of Conferences, Vol. 217, 2018.
4. Statistical Analysis of Turbidity for Monitoring Divalent Heavy Metal Concentration Using Analog Data Acquisition, 6th BICET, Brunei, 2016.
5. Empirical Models for Predicting Longitudinal Contaminant Transport in 1D Steady Pipe Flow Systems, 7th TSME–ICoME, Thailand, 2016.
6. Simplified Instrument for Real-Time Metal Ion Concentration Monitoring in Effluent Discharge, ICVSSD, Malaysia, 2017.
7. Wireless Communication with GUI for Real-Time Monitoring of Industrial Wastewater, AUN/SEED-Net Regional Conference on EEE & ISITIA, Indonesia, 2017.
8. Prediction of Trace Elements Using PWM-Based Sensor Control Systems, AEROMECH, IOP Conference Series: Materials Science and Engineering, 2017.
1. Facile Laser Fabrication of Free-Standing Structures for Airflow Sensing, 41st Symposium on Sensors, Micromachines and Application Systems, Sendai, Japan, 2024.
2. Fabrication of Diaphragm Structures Using Fiber Laser Local Etching, IEEJ National Convention, Tokyo, Japan, 2025.
3. Optimization of Metal Thin Film Cutting via 2D Fiber Laser Processing Condition Mapping, 42nd Symposium on Sensors, Micromachines and Application Systems, Utsunomiya, Japan, 2025.
Leaderships
- Technical Mentor: Mentored 3 engineers, led 3 NPI programs, and delivered 9 high-impact process improvement projects
- Team Leadership: Supervised 15 process and equipment technicians in manufacturing and NPI environments
- Organizational Leadership:
President, Malaysian Student Society (University Level)
Head Prefect, Secondary School
Publications
Journal Articles (4)
International Conference Proceedings (8)
1. An Electroanalytical Instrument with Wireless Communication and GUI for Real-Time Wastewater Monitoring in the Batik Industry, Journal of Mechanical Engineering (SCOPUS), 2017.
2. Laser Micromachining of 3D Free-Standing Structures for MEMS Thermal Flow Sensors, IEEE Sensors Journal, 2025.
3. Laser Fabrication of Titanium Stent with Integrated MEMS Flow Sensor for Implantable Respiration Monitoring, Sensors and Actuators A: Physical, 2025.
4. Single-Step Laser Patterning and Thinning of Biocompatible MEMS Flow Sensors, Sensors and Actuators A: Physical, 2025.
International Conference Proceedings (8)
1. Single-Step Laser Fabrication of 3D Free-Standing Origami MEMS Thermal Sensor, IEEE SENSORS, Kobe, Japan, 2024.
2. Laser Micromachined 3D-Shaped Free-Standing Structures on Flexible Substrate for Thermal Flow Sensor, 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Orlando, USA, 2025.
3. Motion Analysis of a Low-Cost Customized A-Scan Non-Destructive Testing Unit, MATEC Web of Conferences, Vol. 217, 2018.
4. Statistical Analysis of Turbidity for Monitoring Divalent Heavy Metal Concentration Using Analog Data Acquisition, 6th BICET, Brunei, 2016.
5. Empirical Models for Predicting Longitudinal Contaminant Transport in 1D Steady Pipe Flow Systems, 7th TSME–ICoME, Thailand, 2016.
6. Simplified Instrument for Real-Time Metal Ion Concentration Monitoring in Effluent Discharge, ICVSSD, Malaysia, 2017.
7. Wireless Communication with GUI for Real-Time Monitoring of Industrial Wastewater, AUN/SEED-Net Regional Conference on EEE & ISITIA, Indonesia, 2017.
8. Prediction of Trace Elements Using PWM-Based Sensor Control Systems, AEROMECH, IOP Conference Series: Materials Science and Engineering, 2017.
1. Facile Laser Fabrication of Free-Standing Structures for Airflow Sensing, 41st Symposium on Sensors, Micromachines and Application Systems, Sendai, Japan, 2024.
2. Fabrication of Diaphragm Structures Using Fiber Laser Local Etching, IEEJ National Convention, Tokyo, Japan, 2025.
3. Optimization of Metal Thin Film Cutting via 2D Fiber Laser Processing Condition Mapping, 42nd Symposium on Sensors, Micromachines and Application Systems, Utsunomiya, Japan, 2025.