Miguel Neto

Plasma Process Development for BEOL patterning applications for SADP/SAQP and MHM for low-k patterning.

Materials: SiO, TiO, TiN, TiSiO, Mo-based, W-based.

1. TiN as MHM for BEOL low-patterning.

2. P18 DME process flow: TiO spacer with enhanced selectivity by Ar.N2 treatment.

3. Conformal Carbides: spacer development for SADP and SAQP.

4. Molybdenum carbide: role of Ar and H2 on low-resistivity applications.

Development of plasma based processes for conformal and gapfill.

Materials: SiO, SiN, BN, TaO2.

1. (in Finaland) SiN P41 process development for ICP. Ar.H2 radical treatment improvement.

2. Boron Nitride as replacement for MHM and ESL.

3. Improving SiO EM by Ta-doping for increased EM for DRAM application.

Process design and development for magnetic sensors using Ion Beam Deposition for tactile sensor applications:

1. Spin Valves: CoFeB/Cu/CoFeB

2. Magnetic Tunel Junctions: CoFeB/MgO/CoFeB and CoFeB/AlOx/CoFeB.